国家/地区 韩国（2） 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2023（2）
申请年 2021（3）
专利权人

Manufacturing conductive ink useful in circuit board for next generation electronic device comprises e.g. mixing guar gum, xanthan gum, or hydroxyethyl cellulose with heated solvent, and mixing ethylene glycol, or propylene glycol.

HYOYOUNG M

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A