国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年 2022（2）
专利权人

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Heat-conducting and wave-absorbing nano-grade composite material for function-wide frequency spectrum, comprises heat conducting alumina powder, absorbing powder, medium ceramic powder, graphene, cross-linking agent, curing agent, catalyst, curing delay agent and rest of silicone oil carrier.

DENG S