国家/地区 中国（2）
IPC部 C（2）
IPC大类 C22（2）
IPC小类 C22C（2）
IPC C22F001/02（2）
发明人
公开年 2023（2）
申请年 2022（2）
专利权人

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L

Preparing rGO/silicon dioxide coating on aluminum-magnesium-silicon alloy plate surface, comprises selecting polar plate, using computer engraving technology to engrave single-channel snake-shaped flow field, and removing oil and impurity.

SHAO C, HUANG J, YUAN B, LIU J, ZHANG L