国家/地区 美国（5）
IPC部 B（5）
IPC大类 B32（5） H01（4） H05（3）
C08（2）
IPC小类 B32B（5）
IPC B32B007/025（2） B32B027/20（2） B32B027/32（2）
C08K003/04（2）
发明人
公开年 2023（5）
申请年 2022（5）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Semiconductive polyolefin composition in power cable, comprises olefin polymer base resin, first carbonaceous structures, carbon black and/or second carbonaceous structures, and optionally additives, where first carbonaceous structures are selected from graphene, and modified graphene.

THEODORIDIS A, MANIKA G, KADAR R, GKOURMPIS T

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Producing porous metal matrix composite for electrodes used in acid battery, involves providing and stacking first metal material and layer including multiple of spacing materials to form stack, pressing stack by applying pressure, and heating stack under pressure to melt portion.

CHIANG S, TZENG Y, JIANG S, ZENG Y, TZENG Y R, CHIANG S H