国家/地区 日本（2）
IPC部 C（2）
IPC大类 C01（2） C23（2） H01（2）
IPC小类 C01B（2）
IPC C23C016/26（2）
发明人 IFUKU R（2） MATSUMOTO T（2） WADA M（2）
公开年
申请年 2022（2）
专利权人 TOKYO ELECTR.（2）

Film forming method involves loading substrate into processing container, forming interface layer having amorphous structure or microcrystalline structure on substrate by plasma of first mixed gas including carbon-containing gas and forming graphene film on interface layer.

NAKAMURA G, TERADA H, MATSUMOTO T, KABUKI N, WADA M, IFUKU R, NAKAMURA K, KAMURAGI N

Processing substrate by loading substrate into processing container, forming carbon film on substrate with plasma of mixed gas containing carbon-containing gas while inside of processing container is maintained at pressure, and changing inside of processing container.

WADA M, IFUKU R, MATSUMOTO T, YAMADA H, TAKASHI M