国家/地区 中国（6）
IPC部 C（7）
IPC大类 C09（7） H01（5） H05（3）
IPC小类 C09D（7）
IPC C09D011/03（7）
发明人 LI L（2） PAN Z（2） ZHOU M（2）
公开年 2022（4） 2023（3）
申请年 2022（7）
专利权人 ANHUI AEROSP.（2）

Conductive ink composition useful in transparent conductive film, comprises 2,4-toluene diisocyanate, polyethylene glycol, epoxy resin, conductive carbon black, conductive graphite, curing agent, solvent, and dispersant, where epoxy resin is bisphenol-A-type epoxy resin epoxy resin.

WANG D

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M

Preparing conductive ink comprises preparing oligomer containing cholesterol monomer, and taking oligomer as dispersant, adding carbon-based material into non-polar solvent, ultrasonically dispersing and concentrating.

ZHOU M, PAN Z, LI L

Preparing graphene electrothermal film comprises e.g. coating adhesive on surface of release layer away from graphene conductive layer exposed after peeling off base material to form second adhesive layer, bonding second fiber fabric to second adhesive layer and performing to hot pressing operation.

ZHOU M, PAN Z, LI L

Insulating ink useful e.g. for packaging semiconductor passive element and voltage division comprises e.g. polyurethane resin, phenolic resin, epoxy resin, additives, solvent, carbon material composite, carbon material composite, and zero-dimensional fullerene carbon material.

ZHAO J, XIANG W, ZHANG B, ZHANG Y, HUANG S, GAO J

Manufacturing method of transparent flexible film electrode, by coating surface of the substrate with polyimide, obtaining heat-conductive protective layer, coating UV curing liquid on surface of coating polyimide after obtaining electrode pattern and curing to obtain transparent packaging layer.

PENG L, ZHAN S, ZENG X, JIN S