国家/地区 中国（4）
IPC部 C（4）
IPC大类 C25（4） C01（2）
IPC小类 C25D（4）
IPC
发明人 WANG J（4）
公开年 2023（3）
申请年 2022（4）
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Preparing nano-copper/graphene composite coating using pulse brush plating technology comprises e.g. sensitizing the graphene surface, preparing the suspension, adding surfactant, performing electroless copper plating, ultrasonically stirring, and adopting brush plating solution to prepare coating.

WANG J, QIAO Y, WANG X, LIU S, ZOU Y, ZHAO G

Forming graphene radiating layer on aluminum surface, comprises dispersing graphene oxide in dilute sodium sulfate solution, electroplating in dispersion solution with aluminum part as anode, stopping current, and immediately drying surface of workpiece.

WANG J, LU Y, GE M, ZHANG F, CUI D

Packaging carrier plate has alumina ceramic plate whose one surface has three-dimensional conical structure layer of alumina ceramic, where copper-graphene composite material layer is compounded on three-dimensional conical structure layer.

LIANG N, WU S, WANG J, SUN C, ZHANG D, ZHANG W, SONG X