国家/地区 中国（4） 美国（3） 日本（2） 世界知识产权组织（2）
IPC部 B（7）
IPC大类 C09（7）
IPC小类 H01B（7）
IPC C09D005/24（2） C09D201/00（2） C09K005/14（2）
H01B001/02（2） H01B001/04（2） H01B001/24（2）
H01B005/14（2） H01B013/00（2）
发明人
公开年 2022（5） 2023（2）
申请年 2022（7）
专利权人

Flexible pressure-sensitive material containing graphene useful in gait monitoring comprises graphene, ethanol and manganese-copper composite metal powder.

WU J, WANG T, ZENG Z, SHANG P, LUO C, SU D

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Preparing copper/ graphene composite material for e.g. power transmission comprises carrying out one-time hydrothermal method, adding copper salt and reducing agent into beaker , transferring solution into constant temperature water bath, performing suction filtration, washing, and vacuum drying.

MA J, DU W, PANG J, ZHANG L

Manufacturing conductive pigment paste includes dispersing paste containing pigment dispersion resin, conductive pigment and solvent by at least one disperser selected from bead mills, homogenizers, ultrasonic dispersers, kneaders, extruders, and planetary mixers.

ENDO K, HASHIMURA M, KITAMURA T, YUKAWA Y, YUGAWA Y

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M

Preparing thermally conductive insulating graphene-boron nitride material comprises exfoliating hexagonal boron nitride by ultrasonic treatment and high-temperature hydrothermal treatment, and placing in dimethylformamide solution.

LU S, DONG C, LI T, GU C, XIA Y, PANG X