国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09J（2）
IPC C09J011/04（2）
发明人
公开年 2023（2）
申请年 2023（2）
专利权人

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

White foaming film comprises polyolefin elastomer, initiator, cross-linking agent, coupling agent, antioxidant, light stabilizer, white foaming layer, polyolefin elastomer, heat conducting filler, heat conducting fiber, initiator, cross-linking agent, coupling agent, antioxidant and light stabilizer.

XIA C, ZHANG G, HUANG B, LV S, WU F