国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 CHEN Y（2）
公开年 2023（2）
申请年 2023（2）
专利权人

Fan-out type packaging structure for packaging electronic components in system level for portable electronic product i.e. notebook computer, has third chip group that is set on second solder layer, and electrically connected with second wiring layer through second solder layer.

CHEN Y, ZHU W

Manufacturing method for improving brightness of chip LED, involves growing P-type gallium nitride layer to complete structure on second graphene layer by using metal organic chemical vapor deposition method.

CHEN Y, XU Y, WANG J, XU P