国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） C08L（5） C08G（3）
C08J（3）
IPC C08K003/04（5）
发明人
公开年 2023（5）
申请年 2023（5）
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Anti-interference material useful for anti-interference film used in electrochemical sensor and color test paper, comprises carboxylated material; carboxylated material includes at least one of carboxylated material containing conjugated pi bonds and carboxylated molecular sieves.

XIAO W, ZHANG X, SHI X, YANG H

Preparing nano conductive polymer used for energy storage and photoelectric conversion, by freezing initiator solution into ice body, subjecting template material to hydrophilic treatment, dispersing conductive polymer monomer in acidic solution and carrying out polymerization.

YUAN L, HAN J, CHEN Z, LIU H

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

High-rigidity and low-warping reinforced composite material used in e.g. electrical appliances, comprises nylon resin, glass fiber, steel fiber, nano talc powder, sodium fluorosilicate, nano zinc oxide, flame retardant inorganic filler and carbon nanotubes.

WEI X