国家/地区 世界知识产权组织（3） 欧洲专利局（EPO）（2）
IPC部 C（2） H（2）
IPC大类 C08（2） H01（2）
IPC小类 C08K（2） C08L（2）
IPC C08K003/04（2）
发明人
公开年 2022（2）
申请年 2021（3）
专利权人 3M INNOVATIVE PROPERTIES CO（3）

Thermally conductive structure has thermal interface material (TIM) that is comprised in enclosed space, and in direct contact with first element through first interface area and with second element through second interface area.

GAIDE T, OSTROWSKI K A, TEGEDER P, EICHLER J, BRAND S

Curable, conductive fluoropolymer composition used e.g. make article e.g. gaskets, comprises partially fluorinated amorphous polymer, ionic liquid having cationic and anionic portion, peroxide, crosslinking agent, and conductive particles.

SUZUKI Y, FUKUSHI T

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A