国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人
公开年
申请年
专利权人 ADVANCED MICRO DEVICES INC（2）

Computing device, comprises substrate, die coupled to substrate, heat spreader thermally coupled to die and comprising body of thermally conductive material having cavity partially surrounding die, and graphene layer contacting surface of body.

CHOW S P, AN L, JI X, ZHOU X

Method for forming graphene liner and capping layer on conductive line/via of e.g. application specific integrated circuit device, involves performing chemical mechanical polishing process to remove excess amounts of copper-based material.

RYAN E T, KRIVOKAPIC Z, ZHANG X, WITT C, HE M, ZHAO L, WURTH C