国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人
公开年 2022（2）
申请年
专利权人 ADVANCED SEMICONDUCTOR ENG INC（2）

Semiconductor substrate comprises interconnect piece comprising first metal layer located on substrate of surface substrate, second metal layer on first layer, and adhesion layer located between first and second metal layers.

ZHANG H, CHEN Z

Radiating structure for packaging structure has metal layer comprising crystal seed layer formed with metal layer, metal parts separated from each other set on seed layer, crystal seeds connected with each other through hole, through hole formed between crystal seeds.

LV W