国家/地区 中国（2）
IPC部 H（2）
IPC大类
IPC小类
IPC
发明人 TUOMINEN M（2） ZHENG X（2）
公开年
申请年 2020（2）
专利权人 AT S AUSTRIA TECHNOLOGIES SYSTEM TEC（2）

Component carrier, comprises continuous vertical through connecting portion extending between two opposite main surfaces of component and extending straight through component and continuing to extend directly through structure of carrier.

ZHENG X, TUOMINEN M

Carrier for e.g. electronic components comprises stacked electrically insulating layer structures, and through hole with narrower inner portion compared to exterior portions and filled with electrically conductive filler.

TUOMINEN M, TAY S K, SUN S, ZHANG R, ZHENG X, SUN L, ZHANG Z