国家/地区 中国（2）
IPC部 G（2） H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 HE M（2） XIAO Y（2）
公开年 2021（2）
申请年 2020（2）
专利权人 CTRON ADVANCED MATERIAL CO LTD（2）

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Thin film flip chip package structure for display device, has adhesive piece set on thin film substrate, chip and radiating piece, where adhesive piece fills gap between chip and thin film substrate.

HE M, HUANG J, XIAO Y