国家/地区 韩国（3）
IPC部 C（3） H（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/194（2）
发明人 KYOUNGJEONGBAE（3） CHOI S（2）
公开年 2021（3）
申请年 2020（3）
专利权人 ELEMENT CO LTD KB（3）

Dicing tape useful for fixing semiconductor wafer, comprises adhesive layer formed on one surface of conductive base film made of carbon nanotubes and graphene and attached to rear surface of semiconductor wafer.

KYOUNGJEONGBAE

Continuous mass-production of graphene using thermal plasma without using graphite oxide and acid and without reduction process, comprises e.g. generating plasma by injecting inert gas into plasma device and exfoliating graphene.

KYOUNGJEONGBAE, CHOI S, NGUYENDINHHUONG, NGUYEN D H, CHOI S H, BAE K J, CUI X, BAE K, CHAE S H, NGUYEN D F

Preparing graphene-filler composite thermally conductive material involves generating a graphite intercalation compound (GIC) by performing an electrochemical reaction on a graphite sheet, preparing a first dispersion solution.

KYOUNGJEONGBAE, CHOI S, HWAN B J