国家/地区 中国（5）
IPC部 H（3） B（2） C（2）
IPC大类 H01（3） C08（2）
IPC小类 H01B（3） C08K（2） C08L（2）
IPC H01B013/00（3） C08K003/04（2） C08K003/08（2）
C08K003/22（2） C08K003/28（2） C08K003/34（2）
C08K003/38（2） C08K009/06（2） C08L083/04（2）
H01B001/22（2） H01B001/24（2）
发明人 HAN Z（5） SONG Q（5） MEN Z（3）
WANG B（2）
公开年 2021（5）
申请年 2021（5）
专利权人 HIT ROBOT GROUP WUXI SCI TECHNOLOGY（5）

Conductive slurry useful for printing circuit and electromagnetic shielding field, comprises binder, dispersant, defoamer, conductive filler and diluent.

MEN Z, HAN Z, SONG Q

Preparing low-silver aqueous conductive silver paste for e.g. polyethylene terephthalate film, involves ball-milling adhesive, defoaming agent, dispersant and non-metal conductive powder to obtain dispersion liquid, adding silver powder to disperse to obtain slurry, and defoaming.

MEN Z, HAN Z, SONG Q

Preparation device used for preparing integrated polyimide thermally conductive grid film/thermally conductive silica gel composite material, comprises side inner walls which are in each direction equipped with adjustable height clamps for clamping polyimide thermally conductive grid film.

SONG Q, WANG B, HAN Z

Composite thermal conductive material with soft surface with grid distribution for forming grid structures, has heat-conducting cover layer which is arranged on heat-conducting substrate on which graphene composite heat-conducting sheet is placed.

SONG Q, WANG B, HAN Z

Preparing aqueous conductive paste material involves mixing and grinding deionized water and conductive synergist to obtain slurry A, mixing and grinding aqueous emulsion, antifoaming agent, dispersing agent and conductive carbon powder to obtain slurry B.

SONG Q, HAN Z, MEN Z