国家/地区 中国（2）
IPC部 H（2）
IPC大类
IPC小类
IPC
发明人 HUANG Z（2） SHENG B（2） WANG G（2）
YAN P（2） ZHANG J（2）
公开年 2021（2）
申请年 2021（2）
专利权人 JINAN BAIXIANG TECHNOLOGY DEV CO LTD（2）

Manufacturing technique of graphene chip packaging structure involves preparing packaging shell and two metal plates, spraying insulating coating on one side surface of each metal plate, and curing sealing glue at normal temperature.

HUANG Z, YAN P, WANG G, ZHANG J, SHENG B, WANG N

Graphene heating chip based heat radiating device, has heat conducting shell fixedly connected with radiating body, and graphene chip fixedly connected with heat conducting shell, where contact of graphene chip is connected with lead.

HUANG Z, WANG G, YAN P, GU X, LI W, SHENG B, ZHANG J, HE A