国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09J（2）
IPC C09J009/02（2） C09J011/04（2） C09J161/14（2）
C09J201/00（2）
发明人 LU J（3）
公开年 2021（3）
申请年 2021（3） 
专利权人 LU J（3）

Positive temperature coefficient heating body packaging structure; graphene conductive adhesive used in packaging structure comprises e.g. far-infrared emitting agent, copper powder, and high temperature resistant high molecular materials.

LU J

Graphene conductive adhesive for bonding positive temperature coefficient (PTC) heating sheet, comprises far-infrared emitter, graphene, copper powder and high-temperature resistant polymer materials, where high-temperature resistant polymer material contains high-temperature resistant glue.

LU J

Graphene coated carbon black material comprises carbon black powder, graphene nano sheets, filler, silane coupling agent, hydrocarbon organic solvents, dispersant, antioxidant and deionized water.

LU J, GU J