国家/地区 中国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 WANG Q（2）
公开年
申请年
专利权人 NAT CENT ADVANCED PACKAGING CO LTD（2）

Preparing organic substrate composite material comprises e.g. preparing semi-curing structure, pre-treating fiber filler, implanting into semi-curing structure, preparing filler solution and stable film structure, freezing and drying.

ZHANG J, CAO L, WANG Q

Flexible substrate based three-dimensional packaging heat radiation structure, has graphene radiating fin fixed to contact surface of chip package body, and graphite heat abstractor provided with metal carrier chip.

CAO L, GUO X, HOU F, WAN L, SU M, WANG Q, ZHOU Y