国家/地区 韩国（3）
IPC部 C（3）
IPC大类 C01（2） C08（2）
IPC小类 C01B（2） C08K（2）
IPC C08K003/04（2）
发明人
公开年 2023（3）
申请年 2021（3） 
专利权人 POSTECH ACADIND FOUND（3）

Manufacturing semiconductor useful in filed of power conversion devices, electric and electronic systems, comprises e.g. implanting dopant into semiconductor, capping material into two-dimensional honeycomb, and heat treating.

KIMSEONGJUN, KANG M J, SHIN H K, LEE N S, JAE P Y, SUNG M J

Graphene hydrogel used as conductive component to fabricate reconfigurable circuits on demand by exploiting its self-healing behavior, comprises graphene and imidazolium polymer bonded to the surface of the graphene by cation-pi interaction.

KIM Y S, IMKYUNGHAN

Producing nanosheet dispersion comprises reducing interlayer bonding strength by adding two-dimensional material having layered structure into solution containing aionic material and forming covalent bond by entering between layers.

NOHYONGYOUNG, KIM H J, KIM H, NOH Y Y, LU R