国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人
公开年 2013（2）
申请年 2012（2）
专利权人 SAMSUNG ELECTRONICS CO LTD（2）

Interconnect structure for integrated microelectronic circuit, has graphene cap which is provided with edges that are vertically coincident with edges of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D, DIMITRAKOPOULOS C, HANNON J, NEUMAYER D, OTT J, DIMITRAKO P C D, GREER A

Heterogeneous laminate used e.g. in thermoelectric element of thermoelectric module which is used in thermoelectric apparatus, comprises graphene and thermoelectric inorganic compound (e.g. cobalt-antimony compound) disposed on graphene.

CHOI J, BAIK S, HONG S, KIM W, KIM E, LEE Y, BAIK S H, CHOI J Y, HONG S H, KIM E S, KIM W Y, LEE Y H, BAEK S, LI Y