国家/地区 中国（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类
IPC
发明人 LIANG X（2）
公开年 2021（2）
申请年 2020（2） 
专利权人 SHENZHEN ADVANCED ELECTRONIC MATERIAL（2）

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Thermally conductive double-sided adhesive tape includes a substrate, a thermally conductive adhesive film and a release film, and both sides of the base layer are coated with a thermally conductive adhesive film containing holes.

LAI Z, LIANG X, ZHAO T, SUN R