国家/地区 中国（2）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人
公开年 2023（2）
申请年 2023（2）
专利权人 UNIV JIANGSU SCI TECHNOLOGY（2）

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Preparing germanium embedded graphene layer-based three-dimensional carbon network composite material useful in preparing lithium-ion battery cathode, comprises e.g. preparing pluronic F-127 solution, adding germanium(IV) oxide, graphene oxide and carbon nanotubes, sonicating, and carbonizing.

LIU Y, ZHENG X, GUO X, GU H, ZHANG J