国家/地区
IPC部
IPC大类
IPC小类
IPC
发明人 ZHAO Y（2）
公开年 2022（2）
申请年
专利权人 ZHAO Y（2）

Packaging method of radiator of processor used in electronic equipmen, involves sleeving rib on heat column of bottom plate to form intermediate assembly, coating graphene on intermediate component, coating middle component with graphene coating, so that rib is fixedly assembled with bottom plate.

ZHAO Y

Composition for three dimension (3D) printing micro-scale structure such as multiwall plate devices, comprises thermoplastic elastomer, particulate matter, and solvent.

RADISIC M, ZHAO Y, WU Q