国家/地区 中国（22） 世界知识产权组织（3）
IPC部 C（17） H（9） B（6）
IPC大类 C23（9） H01（9） C25（8）
B22（4） C22（4） C01（3）
IPC小类 C23C（9） C25D（7） B22F（4）
H01B（4） H01H（4） C01B（3）
C22C（3）
IPC C23C016/26（9） C25D003/46（7） C25D015/00（7）
C23C016/44（4） H01B013/00（4） C22C001/05（3）
H01B001/02（3） H01B001/04（3） B22F001/16（2）
B22F007/04（2） C01B032/194（2） C22C009/00（2）
C23C016/02（2） H01H001/027（2） H01H011/04（2）
发明人 MA Y（10） HU Y（8） LIN J（8）
LIN R（8） SHEN H（8） SHEN Q（8）
WANG C（8） XU Z（8） ZENG L（8）
ZHENG J（8） ZHOU J（8） OTHER I R N（7）
CAO H（5） JI S（4） LV X（4）
公开年 2022（22）
申请年 2021（12）  2020（6）  2022（4） 
专利权人 ZHEJIANG CHINT ELECTRICS CO LTD（22）

Preparing metal-based graphene composite material, comprises mixing graphene slurry and metal powder to form mixed slurry, and forming mixed slurry into metal-based graphene composite material by chemical vapor deposition in oxygen-free environment.

QIAN T, CAO H, SHEN H, LV X, MA Y

Growing single-layer graphene useful in semiconductor device involves fixing copper foil on cathode, placing in acidic electrolyte, applying voltage between working and counter electrodes, placing copper foil and growing single layer graphene on both sides of copper foil by chemical vapor deposition.

SHEN H, MA Y

Preparing electric contact conductor, used in graphene method, used for agglomeration, involves pressing metal granules into metal framework with through-hole, filling graphene into throughhole to form prefabricated structure, and extruding and stretching pre-built structure to form electric contact.

WANG J, HUANG H, LI Z

Welding device for soldering graphene silver point, has second electrode that is opposite to end face of second electrode and driving assembly drives cotton wheel to rotate and polish second electrode.

HUANG Q, GAO Y, LI L

Corrosion-resistant paint used in e.g. petrochemical industry, comprises resin, dispersant, defoamer, co-solvent, wetting agent, zinc powder, graphene, curing agent, sealant and water.

SHI J, ZHAO D

Composite dispersant useful for blocking or slowing agglomeration of graphene in dispersion liquid, comprises distilled water and 2-ethylhexyl sulfate sodium salt.

OTHER I R N, ZHENG J, LIN J, SHEN Q, WANG C, ZHOU J, XU Z, LIN R, ZENG L, HU Y

Compound type dispersant useful for mixed electroplating solution, comprises distilled water, nonionic surfactant, anionic surfactant and wetting agent.

OTHER I R N, ZENG L, ZHOU J, XU Z, LIN R, WANG C, ZHENG J, HU Y, LIN J, SHEN Q

Composite type dispersant useful for mixed electroplating solution, comprises distilled water, naphtholsulfonic acid condensate salt and strong alkali.

OTHER I R N, ZHOU J, XU Z, LIN R, HU Y, LIN J, SHEN Q, ZENG L, WANG C, ZHENG J

Composite dispersant useful in preparing mixed electroplating solution, comprises e.g. distilled water, nonionic surfactants, anionic surfactants and medium dodecylphenol polyoxyethylene ether, alkylphenol polyoxyethylene ether, polyethylene glycol, and fatty acid methyl ester ethoxylate.

OTHER I R N, LIN R, WANG C, HU Y, ZHENG J, LIN J, SHEN Q, ZENG L, ZHOU J, XU Z

Composite dispersant useful in preparing mixed electroplating solution comprises distilled water, Tween composite as nonionic surfactant, hydrocarbyl sulfonate composite as anionic surfactant, and amide composite as wetting agent.

HU Y, WANG C, LIN R, JI S, XU Z, ZHOU J, ZENG L, SHEN Q, LIN J, ZHENG J, OTHER I R N