国家/地区 中国（4）
IPC部 C（3） H（2）
IPC大类 C04（2） H01（2）
IPC小类 C04B（2）
IPC C04B035/622（2）
发明人 FEI W（4）
公开年 2022（3）
申请年 2022（4）
专利权人 HARBIN INST .（3）

Anti-spill fence of thermally conductive material for semiconductor chip of semiconductor device, has inner core, bonding glue and external packing material.

FEI W

Ultra-high performance carbon-based material is chemical bond connecting graphene sheet composed of carbon element and graphite of carbon, which is graphene reaction to generate high-strength stable chemical bond forming key substance.

FEI W, LIU B, WANG Y, LI J, WANG L

Method for preparing a high-strength carbon-based material based on combustion synthetic graphite used as nuclear graphite electric spark processing tool electrode, involves using combustion-synthesized graphene and/or doped combustion graphene and sintering.

FEI W, LIU B, WANG Y, LI J, WANG L

Preparation of in-situ self-generated graphene/copper composite material with composite interface structure, used for e.g. large-scale integrated circuit lead, comprises heating raw material copper in air, soaking in formic acid, drying, and heating and carbonizing treatment.

ZHANG L, SHENG J, WANG L, FEI W