国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 HE Z（2）
公开年
申请年
专利权人

Packaging structure for organic LED (OLED), has encapsulation layer with graphene layer and growth layer, such that growth layer is positioned above LED and graphene layer is located above growth layer.

CHEN L, HE Z, NIU Y, TIAN H

Method for manufacturing semiconductor device, involves forming grid medium layer between graphene-containing layer and exposed seed layer using photo resist as mask and forming gate metal on gate dielectric medium to remove photo-resist.

WEI C, LI J, LIU Q, FENG Z, WANG J, HE Z