国家/地区 中国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC H01L033/64（2）
发明人 HOU X（2）
公开年 2013（2）
申请年 2013（2） 
专利权人 UNIV XIAN JI.（2）

LED chip perpendicular structure has substrate that is provided with graphene layer, zinc oxide nano wall structure, gallium nitride layer, indium-gallium nitride layer multi quantum layer and p-gallium nitride.

AN J, ZHANG J, BU E, HOU X, LI F, MENG L

Composite substrate for mounting vertical LED chip, has substrates which are made of graphene, copper tungsten, molebinum and silicon or silicon carbide and are in sequence order.

ZHANG J, SONG J, BU E, HOU X, LI F, MENG L