国家/地区 台湾（3）
IPC部 H（3）
IPC大类 H01（3）
IPC小类 H01L（2）
IPC
发明人 HU Y（3）
公开年 2021（2）
申请年
专利权人

Chip packaging unit has graphene coating which is disposed on heat dissipation paste cured layer.

YEN H, HUANG H, HU Y

Polymer-polymer-positive-temperature-coefficient-material for use in e.g. graphene-filler-component, comprises polymer-matrix, polymer, and/or polymeric-containing material.

ZHOU Z, FU Y, CHEN J, JOE J, HU Y

Composite nanofiber used in photoanode of dye-sensitized solar cells, comprises titanium dioxide nanofiber and composite modified material containing zirconium dioxide and reduced graphene oxide.

NIEN Y H, XU H, CHEN H, HU Y, CHOU J C, YONG Z