国家/地区 韩国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 KIM K（2）
公开年 2020（2）
申请年
专利权人

Interconnect structure for use in electronic device, has graphene-metal barrier arranged on substrate, where graphene-metal barrier includes graphene layers and metal particles on grain boundary of graphene layers and between layers.

SHIN K, KIM K, KIM H, SHIN H, LEE S, SHIN K W, KIM K B, MI K H, SHIN H J, LEE S H

Polyimide composite film used for electronic component, comprises core layer comprising polyimide resin and graphene, and skin layer comprising another polyimide resin, and has preset electromagnetic wave shielding rate and tensile strength.

LEE K N, KIM K H, KIM K