国家/地区 美国（4）
IPC部 B（3） H（3）
IPC大类 H01（3） B23（2） B82（2）
IPC小类 H01B（3） H01L（3） B23P（2）
B82Y（2）
IPC H01B001/04（3） H01L023/373（3） B23P019/04（2）
B82Y040/00（2） H01B001/02（2）
发明人 KIM N P（4）
公开年 2015（2）
申请年 2015（2） 
专利权人 BOEING CO（4）

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Method for forming graphene metal matrix composite into e.g. heat spreaders for providing cooling to power inverter/converter, involves stacking graphene metal matrix composite layers to form graphene metal matrix composite.

KIM N P, HUANG J P

Method of forming graphene metal matrix composite for e.g. semiconductor device, involves removing solvent containing graphene nanoplatelets to form uniformly oriented graphene layer which is included within metal matrix.

KIM N P, HUANG J P

Graphene nanoplatelet metal matrix composite for semiconductor device e.g. semiconductor chip, has graphene comprising graphene nanoplatelets, which is uniformly and horizontally oriented in metal matrix.

KIM N P, HUANG J P