国家/地区 韩国（4）
IPC部 H（3） C（2）
IPC大类 H01（3）
IPC小类
IPC
发明人 KIM S I（4）
公开年 2023（4）
申请年 2022（2） 
专利权人

Packaging unit for directly cooling semiconductor device, has thin film structure that is provided with pattern portion which is formed in partitioning portion of fluid movement area to include same height as edge portion and closely adhere to flow channel of substrate.

PARK J, KANG M S, KIM H C, LEE H, JANG S J, JEONG H, CHOI I K, KIM S I, LEE S, AHN H, LIM J

Method for producing catalyst for polymer electrolyte membrane fuel cell (PEMFC), involves supporting metal nanoparticles to have specific diameter range on two-dimensional carbon carrier by applying microwaves to second solution.

HYO K T, HYUN L D, KIM S I, JUNG P, LIM S Y

Water-based paint composition comprises vinyl acetate-ethylene-based resin powder, water, calcium carbonate, titanium dioxide, diatomaceous earth, silicon dioxide, water-soluble solvent, and two graphene oxides having particle size.

KIM S I, SHON J, IM S H, KIM Y H, JEON J Y

Optical device structure comprises optical fiber including core unit, clad unit, and three-dimensional micro hole structure in the clad unit, where surface of three-dimensional micro hole structure is provided with conformal graphene layer formed through nucleation and growth of carbon atoms.

KIM D, KIM S, CHOI J, UDDIN M S, SONG Y W, SONG Y, YOUN C J, KIM S I