国家/地区 韩国（2）
IPC部
IPC大类
IPC小类
IPC
发明人 LEE K J（2）
公开年 2014（2）
申请年 2013（2）
专利权人

Resin composition with enhanced heat releasing properties, used e.g. to manufacture heat releasing film for electronic device, comprises liquid crystal oligomer, epoxy resin or their resin mixture and filler comprising graphene oxide.

LEE K J, KANG J S, SON J B, SHIN S H, SHIN H S, JUNG H C

Patterning method of graphene, involves applying heat in graphene and vaporizing graphene on metal pattern, such that pattern of graphene is removed and formed.

JEONG S M, KANG T H, KIM S H, LEE K J, LHM K W, LIM J T, OH J S, PARK J W, YANG M H, YEOM G Y