国家/地区 韩国（2）
IPC部 C（2）
IPC大类
IPC小类
IPC
发明人 LEE S B（2）
公开年 2021（2）
申请年
专利权人

Composite film used for electronic product, comprises polymer matrix layer in which magnetic fillers are dispersed, and metal mesh impregnated in polymer matrix layer.

CHOA Y H, KIM J R, SONG Y S, CHO H B, LEE S B, JUNG B M, KIM M Y, LIM M S, CHOA Y, SONG Y, CHO H, LIMMINSUP

Composition useful for catalyst-free electroless plating, comprises metal precursors including nickel precursor, and iron precursors, cobalt precursors and/or copper precursors, reducing agent, and plated object.

KIM T, LEE K B, LEE S B, JUNG B M