国家/地区 中国（4）
IPC部 C（3） H（3）
IPC大类 H01（3）
IPC小类 H01L（2）
IPC
发明人 LEE W（4）
公开年 2021（2）
申请年 2020（2） 
专利权人

Method for forming interconnect structure for semiconductor devices, involves forming carbon layer having bonding structure on first metal layer of substrate, and forming second metal layer of substrate electrically connected to first metal layer.

LEE Y, SHIN H, SHIN J, BYUN K, LEE W, AHN S, SHIN K, SHIN K W, BYUN K E, SHIN H J, LEE Y S, SHEN X, LI Y

Fuel cell for hydrogen electric vehicle, comprises electrolyte membrane-electrode assembly, durability enhancing layer containing hydrogen peroxide decomposition catalyst and hydrogen ion conductive polymer, and gas diffusion layer.

IM S U, LEE W J, KIM J W, YOO T H, PARK Y J, PARK Y, JUNWOO K, LEE W, IM S, LI Y, JIN J, YOO T, PIAO Y

Composition used for fabricating semiconductor structure on semiconductor device for removing metal-containing layer of pellicle structure, comprises water, oxidizing agent(s), and acid(s).

CHEN C, CHANG C, LEE Y, LIU W D, WINDOW C, LEE W, LU W, LIU W, LI Y, ZHANG Z, CHEN Z

Preparation of carbon nanotube fibers used in e.g. production of transparent conductive film, involves preparing carbon nanotube aggregate from carbon source in presence of catalyst, contacting aggregate with graphene oxide, and fiberizing.

OH E G, KIM J E, LEE M J, LEE J H, KIM J H, KWON W J, LEE W J, LEE J K, OH E, KIM J, LEE M, LEE J, KWON W, LEE W