国家/地区 台湾（4）
IPC部 H（4）
IPC大类 H01（3）
IPC小类 H01L（3）
IPC
发明人 LIN K（4）
公开年 2021（2）
申请年
专利权人

Package structure used in high-frequency and high-speed fields, comprises substrate, connection pad disposed on substrate, conductive part disposed on connection pad and electrically connected to substrate, and insulating protective layer.

LIN K, LIANG J, LIN C

Semiconductor device comprises gate structure above channel element comprising channel layer containing silicon, germanium or semiconductor elements, and channel layer containing two-dimensional material.

KHADERBAD M A, MA H, LIN G, SHEN Z, SATHAIYA D M, LIN K, SHEN T, KARDERBARTMURUNALAPJIT, SATAYYADANYAKUMAHAVIER, SENSORMIN, DHANYKUMAR S M

Remote heat exchanging module for e.g. portable computer, has heat generated by heat source transferred to second end of second heat conduction element sequentially through the first heat conduction element, and dissipated out of remote heat exchanging module through the heat dissipation element.

LIAO W, LIN K, LIN G

Photovoltaic element, includes a graphene material which is applied to a transparent conductive film or an electrode of a photovoltaic element.

WANG C, CHIOU Y, LIN K, LIN Y