国家/地区 美国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC H01L023/00（2） H01L025/065（2）
发明人 NAKANO E（2）
公开年 2022（2）
申请年 2021（2）
专利权人 MICRON TECHN.（2）

Anisotropic conductive film structure comprises array of discrete conductive regions within continuous region of adhesive dielectric material, where discrete conductive regions of array is mutually laterally spaced by pitch, and discrete conductive regions comprises conductive carbon-based material.

TUTTLE M E, NAKANO E

Semiconductor assembly comprises substrate having top surface and including graphene layer below top surface and configured to transfer thermal energy along lateral direction across substrate, semiconductor device over top surface of substrate, thermal connector and heat spreader.

NAKANO E, FAY O R, YOO C H