国家/地区 韩国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01B（2）
IPC H01B001/04（2） H01B013/00（2）
发明人 RYU J C（2）
公开年 2017（2）
申请年 2016（2）
专利权人 HAESUNG DS C.（2）

Frontal structure, has graphene coating film formed in order to surround copper wire with rapidity thermal chemical vapor deposition process, where copper wire is extended to one-way direction.

WON D K, LIM H T, RYU J C, YUAN D, LIM H, RYU J

Coating apparatus of conducting wire for connecting semiconductor device and electronic device, has coating unit that laminates insulating layer on conducting wire on which graphene layer is formed.

WON D K, RYU J C