国家/地区 世界知识产权组织（5）
IPC部 C（5） B（4） H（2）
IPC大类 C01（5） B82（3） B32（2）
H01（2）
IPC小类 C01B（5） B82Y（3） B32B（2）
H01L（2）
IPC C01B032/182（4） B82Y030/00（3） B82Y040/00（3）
B32B009/00（2） C01B032/198（2） H01L029/16（2）
发明人 WANG N（5）
公开年 2019（3）
申请年 2018（2） 
专利权人 SHT SMART HI.（3）

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Manufacturing graphene based heat sink involves providing first graphene film, providing second graphene film, arranging layer of nanoparticles on a surface of first and second graphene film, and arranging an adhesive on first graphene film.

LIU J, WANG N

Making vertically aligned laminated graphene based thermally conductive film used in thermal interface material involves e.g. arranging nanoparticles layer on surface of first and second graphene films and arranging adhesive on first film.

LIU J, WANG N

Heat spreading structure comprises first substrate layer, second substrate layer, and conductive graphite film which is sandwiched between first and second substrate layers, where graphite film comprises multiple of graphene layers.

LIU J, WANG N

Manufacturing graphene based film (GBF) for heat dissipation and heat spreading films by providing graphene oxide sheets in aqueous suspension, providing substrate, and heating suspension on substrate to form graphene based film.

LIU J, WANG N