国家/地区
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 WANG W（2）
公开年 2011（2）
申请年 2010（2）
专利权人

Heat dissipation device of electronic/photoelectric element using binding adhesive comprising at least resin and graphene or resin and carbon nanotube between an electronic/photoelectric element and a soaking block.

WANG W

Graphene device structure for complementary metal-oxide-semiconductor, has semiconductor doped regions separated from gate region, where contacts of structure are formed on semiconductor doped regions.

LIU X, ZHU H, WANG W, LIANG Q, JIN Z, ZHONG H, YE T