国家/地区 中国（9）
IPC部 C（6） B（5）
IPC大类 C01（3） B01（2） C08（2）
IPC小类 C01B（3） B01J（2） C08K（2）
C08L（2）
IPC C01B031/04（2） C08L023/06（2） C08L083/04（2）
发明人 WEI X（9）
公开年 2013（9）
申请年 2013（8） 
专利权人 SUZHOU GERUI.（4）

Silver carbonate-graphene oxide composite nanomaterial contains bar-shaped silver carbonate and graphene oxide.

WEI X, DONG C, WU K

Method for preparing high-conductive flexible graphene film electrode, involves cutting prepared graphene film into required shape for obtaining high-conductive flexible graphene film electrode according to application requirements.

CAO J, CHEN Z, WANG W, XU J, WEI X

Preparing oxidative desulfurization amphiphilic catalyst comprises loading oxidative desulfurization catalyst on an amphiphilic catalyst carrier of a graphene modified mesoporous molecular sieve.

WEI X, LIAO B, LIU J, DENG L, GUO Q

Preparation of graphene/carbon nanotube composite comprises taking graphite powder and catalyst precursor to form intercalated graphite and placing in environment suitable for growth of carbon nanotubes.

CHEN M, GAO S, GUO Y, LI W, LIAO S, LIU L, WEI X, XU J, ZHU C

Controllable industrial graphene metal nano-meter structure array preparation method, involves forming platform frame with groove, and reducing temperature of segregation carbon metal solid solution for complete graphene preparation process.

CHEN L, DI Z, WANG G, WANG X, WEI X, ZHANG M

Thin-layered graphene-metal powder composite used as structure material comprises thin bridging graphene and coated with metal powder.

XU J, GAO S, GUO Y, LIU L, LI W, ZHU C, QIU S, WEI X

Preparing thin-layer graphene oxide material comprises mixing graphene microchip and an acid solvent and reacting.

CHEN M, GONG Y, GUO Y, LI W, LIAO S, LIU L, LONG M, QIU S, WEI X

Porous graphene/polymer composite structure used in field of e.g. heat conduction, comprises compound formed by porous graphene and more than one polymer and/or polymer monomer.

GAO S, LI W, LIU L, QIU S, WEI X, WU L

High heat-conducting thin layer graphene composite material used for e.g. heat-conducting device, comprises base and filler components including graphene thin layer, polymer, and/or polymer monomer and high heat-conducting material.

GAO S, GUO Y, LI W, LIU L, LIU P, LONG M, QIU S, WEI X