国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类
IPC小类
IPC
发明人 XIANG H（2）
公开年 2023（2）
申请年 2022（2） 
专利权人

Preparing high abrasion resistance chemical mechanical polishing pad used for production of semiconductor chips, by mechanically dispersing filler and surfactant in organic solvent to obtain dispersion, adding resin solution to dispersion, stirring and coating on transparent film coiled material.

YAO L, CHEN H, XIANG H

Preparing copper-based bipyridine double ligand electrocatalyst useful for removing nitrate in waste water, comprises e.g. mixing copper salt and metal-organic framework ligand, 2,2'-bipyridine and sodium hydroxide, measuring distilled water, filtering, washing and drying.

XIANG H, LIU Q, CHEN Y, LI J, SHU S