国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4） H05K（4） C01B（2）
IPC B32B007/12（4）
发明人
公开年 2023（4）
申请年 2022（2） 
专利权人

Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Satellite surface wave-absorbing skin structure for satellite, has thermal control layer bonded to upper surface of wave-transmitting enhancement layer, wave-absorbing honeycomb layer, and reinforced shielding layer for isolating electromagnetic wave penetration on both sides of absorbing skin.

FU X, MI X, ZHANG H, WANG X, GAO W, XU Y

High-strength graphene heat-conducting gasket in thermal interface material field, has stacking direction of graphene heat-conducting layer is perpendicular to stacking direction of graphene film in any layer of graphene heat-conducting layer.

WANG H, FANG X, SUN A, YANG S, CAO Y

Manufacture of laminated graphene-based thermally conductive film used for electronic assembly, involves providing laminated film comprising graphene film layers separated by adhesive and comprising graphene sheets aligned with plane of graphene film.

LIU J, LAUBECK T