国家/地区 中国（5）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6） C09J（3） B29D（2）
B65D（2） C08K（2） C08L（2）
IPC B32B015/09（6）
发明人
公开年 2022（3） 2023（3）
申请年 2022（6）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Medicine composite packaging film comprises polyethylene layer, adhesive layer, aluminum foil layer, glue layer and polyester layer, adhesive layer comprises polyvinyl alcohol, epoxy resin, nano-aluminum oxide, modified ultra-high molecular polyethylen fiber, modified graphene and coupling agent.

JI Y

Preparation of folding-resistant high-peeling aluminum-coated fabric involves coating coupling agent on etched surface of aluminum foil, coating conductive adhesive on coupling agent layer, pressing fabric on adhesive layer, and sewing.

CHEN Y, YE W, SUN Q, LONG X

Preparing medical packaging film with high barrier property comprises e.g. adding acetic anhydride and modified titanium dioxide-graphene oxide composite, preparing modified titanium dioxide-carboxymethyl cellulose composite, and preparing polyhydroxyl butyric acid valeric acid copolyester film.

ZHOU S, YUAN X, ZHANG C

Black adhesive useful in preparation of first adhesive layer for aluminum-plastic film, comprises reduced graphene oxide, polydopamine, polyurethane resin and solvent e.g. ethyl acetate, toluene or xylene.

LIN J, YU X, WANG H, SONG Y, LI X

Heat conducting heat storage film comprises composite glue layer provided on at least part of surface of one side of first support layer, and second support layer whose one side is connected with heat storage layer and sealed with edge of first support layer.

WANG Y, ZHAO Y, XU J, CHEN T