国家/地区 美国（6）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6） C08J（6） C08K（6）
C08L（2） C25D（2） H05K（2）
IPC B32B015/14（6）
发明人 JANG B Z（4） JHONG Y（4） LEE S（4）
LIN Y（4） ZHAMU A（4）
公开年 2019（4） 2021（2）
申请年 2018（4） 
专利权人 NANOTEK INST.（4）

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Producing surface-metalized polymer film for e.g., diffusion barrier coating, by depositing graphene sheets and conductive filler to primary surface of film, moving graphene-coated film into metallization chamber, and collecting film.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Surface-metalized polymer film used in product e.g. mailer comprises polymer film having primary surfaces, graphene layer having multiple graphene sheets and optional conducive filler, and metal layer having plated metal on graphene layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Apparatus for manufacturing surface-metalized polymer article has graphene deposition chamber accommodating graphene dispersion having multiple graphene sheets and conducive filler and metallization chamber accommodating plating solution.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S