国家/地区 日本（4） 世界知识产权组织（3） 美国（2）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C01B032/194（5）
发明人
公开年 2021（5）
申请年 2020（3）  2021（2） 
专利权人 MITSUBISHI M.（2）

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Graphene bonded body having structure comprises graphene-containing carbonaceous member containing graphene aggregate and member to be joined, junction interface, active metal compound layer formed on member, and tin-concentrated layer.

TOYO O, OHASHI T

Laminated body for electrically-conductive material for use in a battery current collector, comprises graphene coating layer on base material containing metal and/or metallic compound.

KATO T, TAMAKI E

Layered body useful in electronic element, such as transistor, comprises base portion comprising silicon carbide and having surface which is silicon surface, and carbon atom thin film arranged over surface and comprising carbon atoms.

MITSUHASHI F, TATENO Y, ADACHI M, YAMAMOTO Y