国家/地区
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/21（2）
发明人
公开年 2021（2）
申请年 2020（2）
专利权人

Power semiconductor module for inverter device, has laminated N-layers plate-shaped thermally-conductive anisotropic element and power semiconductor element that is bonded to outer plate surface of thermally-conductive anisotropic element of first layer.

TAYA M, SUGAYA Y

Manufacturing electromagnetic wave shielding composite comprises mixing carbon material, aluminum and magnetic precursor in powder form, adding moisture as reactant to mixed powder, heating, washing and drying.

SHIM S E, HWANG S, KIM J, SO J, LEE J