国家/地区 中国（3）
IPC部 C（3）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC C01B033/18（3）
发明人
公开年 2021（3）
申请年 2021（3） 
专利权人

Composite two-dimensional micron-sized silicon wafer comprises two-dimensional micron-sized silicon wafer, titanium dioxide, and graphene oxide.

LUO W, XIA H, SU W, LIU J, FANG C, HUANG J, LI X, LIU B

Preparing silicon-based composite material involves disproportionating silicon monoxide, uniformly mixing disproportionated silicon monoxide with inert lithium powder and carbon source.

LI B, LIANG S

Carbon-silicon-tin composite cathode material comprises carbon material particle substrate and coating layer comprising coating inner layer and coating outer layer, and silicon-tin composite material is honeycomb silicon-based material.

YANG S, DONG H, ZHANG F, ZHENG Y